JPS5961181A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5961181A
JPS5961181A JP57172027A JP17202782A JPS5961181A JP S5961181 A JPS5961181 A JP S5961181A JP 57172027 A JP57172027 A JP 57172027A JP 17202782 A JP17202782 A JP 17202782A JP S5961181 A JPS5961181 A JP S5961181A
Authority
JP
Japan
Prior art keywords
film
insulating film
mask
window
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57172027A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0313745B2 (en]
Inventor
Takashi Ito
隆司 伊藤
Toshihiro Sugii
寿博 杉井
Satoru Fukano
深野 哲
Hiroshi Horie
博 堀江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57172027A priority Critical patent/JPS5961181A/ja
Priority to US06/537,017 priority patent/US4545114A/en
Priority to EP83305971A priority patent/EP0107416B1/en
Priority to DE8383305971T priority patent/DE3380615D1/de
Publication of JPS5961181A publication Critical patent/JPS5961181A/ja
Publication of JPH0313745B2 publication Critical patent/JPH0313745B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/30Devices controlled by electric currents or voltages
    • H10D48/32Devices controlled by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H10D48/34Bipolar devices
    • H10D48/345Bipolar transistors having ohmic electrodes on emitter-like, base-like, and collector-like regions

Landscapes

  • Bipolar Transistors (AREA)
JP57172027A 1982-09-30 1982-09-30 半導体装置の製造方法 Granted JPS5961181A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57172027A JPS5961181A (ja) 1982-09-30 1982-09-30 半導体装置の製造方法
US06/537,017 US4545114A (en) 1982-09-30 1983-09-29 Method of producing semiconductor device
EP83305971A EP0107416B1 (en) 1982-09-30 1983-09-30 Method of producing semiconductor device
DE8383305971T DE3380615D1 (en) 1982-09-30 1983-09-30 Method of producing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57172027A JPS5961181A (ja) 1982-09-30 1982-09-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5961181A true JPS5961181A (ja) 1984-04-07
JPH0313745B2 JPH0313745B2 (en]) 1991-02-25

Family

ID=15934161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57172027A Granted JPS5961181A (ja) 1982-09-30 1982-09-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5961181A (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60216581A (ja) * 1984-04-12 1985-10-30 Fujitsu Ltd 半導体装置の製造方法
JPS60216580A (ja) * 1984-04-12 1985-10-30 Fujitsu Ltd 半導体装置の製造方法
JPS62296560A (ja) * 1986-06-06 1987-12-23 エイ・ティ・アンド・ティ・コーポレーション バイポ−ラ トランジスタ
CN109420974A (zh) * 2017-08-22 2019-03-05 智胜科技股份有限公司 研磨垫、研磨垫的制造方法及研磨方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54155778A (en) * 1978-05-30 1979-12-08 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device and its manufacture
JPS5683063A (en) * 1979-12-12 1981-07-07 Hitachi Ltd Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54155778A (en) * 1978-05-30 1979-12-08 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device and its manufacture
JPS5683063A (en) * 1979-12-12 1981-07-07 Hitachi Ltd Manufacture of semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60216581A (ja) * 1984-04-12 1985-10-30 Fujitsu Ltd 半導体装置の製造方法
JPS60216580A (ja) * 1984-04-12 1985-10-30 Fujitsu Ltd 半導体装置の製造方法
JPS62296560A (ja) * 1986-06-06 1987-12-23 エイ・ティ・アンド・ティ・コーポレーション バイポ−ラ トランジスタ
CN109420974A (zh) * 2017-08-22 2019-03-05 智胜科技股份有限公司 研磨垫、研磨垫的制造方法及研磨方法
US11498181B2 (en) 2017-08-22 2022-11-15 Iv Technologies Co., Ltd. Polishing pad and manufacturing method of polishing pad and polishing method

Also Published As

Publication number Publication date
JPH0313745B2 (en]) 1991-02-25

Similar Documents

Publication Publication Date Title
JPS6226590B2 (en])
JPS59124141A (ja) 半導体装置の製造方法
JPH0722145B2 (ja) 半導体装置の製造方法
JPS60117664A (ja) バイポ−ラ半導体装置
EP0075875A2 (en) Method of making integrated circuits comprising dielectric isolation regions
JPS5961181A (ja) 半導体装置の製造方法
JPS6252950B2 (en])
JPH0338741B2 (en])
JP2707646B2 (ja) 半導体装置の製造方法
JPS603157A (ja) 半導体装置の製造方法
JPH079930B2 (ja) 半導体装置の製造方法
JPH0247853B2 (en])
JPS59220968A (ja) 半導体装置の製造方法
JP3003804B2 (ja) 半導体装置の製造方法
JPS6148935A (ja) 半導体装置の製造方法
JPS60235465A (ja) 半導体装置の製造方法
JPS6279625A (ja) 半導体装置の製造方法
JPS6189667A (ja) 半導体装置の製造方法
JPH0564457B2 (en])
JPH02194533A (ja) 半導体装置の製造方法
JPS5980942A (ja) 半導体装置の製造方法
JPS62281367A (ja) 半導体装置の製造方法
JPH0479327A (ja) 半導体装置の製造方法
JPS5918674A (ja) 半導体装置の製造方法
JPS61102062A (ja) 半導体装置の製造方法